Metallization for Flexible Circuits

Enabling high-density flexible boards

DuPont’s longstanding expertise in electroless copper plating is an excellent match for the demands of flexible and rigid-flex circuits built with polyimide. As more applications migrate to flexible boards, DuPont is committed to providing solutions that will enable high performance in any design configuration. Our highly conductive copper metallization is compatible with roll-to-roll processing and low-stress for long-term durability.

 

Choose DuPont as your materials solutions partner to provide:

• Cost-effective copper plating
• Balanced pH that is suitable for chemically-sensitive polyimide substrates
• Multiple plating options tailored to your specific application
• Meeting Flexible PCB Demands
   

Metallization Materials for PCBs

• Flexible Circuits
• Multi-Layered Boards
• High Density Interconnect
• IC Substrates
   

Flexible Circuits

Copper plating to meet the demands of flexible PCBs.
 

 

• Circuposit™ 200 MLB Process

A patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.

 

• Circuposit™ 4000 Horizontal Electroless Copper

A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications

 

• Conductron™ DP/DP-H Direct Plate Process

Processes especially designed for operation in vertical and horizontal equipment respectively

 

• Copper Gleam™ HGX Electrolytic Copper Plate

Producing uniform crystal grain structure to provide a smooth plated surface on rolled copper
 

• Copper Gleam™ HS-200 Electrolytic Copper

A copper plating process producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.

 

• Duraposit™ Electroless Nickel & Aurolectroless™ Immersion Gold

Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance

 

酸性(xing)鍍銅中(zhong)間體相(xiang)關鏈接(jie)：

垂直連(lian)續電鍍(du)（VCP）高TP值酸(suan)性鍍銅(tong)光澤劑(ji)用電鍍(du)中間體(ti)： benxiaohai.cc/news/170.html
 

PCB/FPC用高TP值(zhi)VCP酸性鍍(du)銅光亮(liang)劑中間(jian)體産品(pin)介紹： benxiaohai.cc/news/30.html
 

2021年(nian)度填孔(kong)鍍銅——印(yin)刷線路(lu)闆（PCB，FPC）酸性(xing)填孔鍍(du)銅中間(jian)體： benxiaohai.cc/news/283.html

 

2021年國(guo)際表面(mian)處理展(zhan)電子展(zhan)廳：

深圳(zhen)市同泰(tai)化學技(ji)術有限(xian)公司參(can)加了2021年(nian)7月26-28日在(zai)廣州保(bao)😁利世貿(mao)博覽館(guan)舉辦的(de)第十四(si)屆廣州(zhou)國際表(biao)面處理(li)、電鍍、塗(tu)裝展覽(lan)會，誠邀(yao)您莅臨(lin)同泰化(hua)學電子(zi)展😥廳參(can)觀🏃🏿‍♀️‍➡️指導(dao)！電子展(zhan)廳🥑️鏈接(jie)：benxiaohai.cc/news/316.html 。